| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a cost-effective wiring board allowing for forming a conductive paste through hole with high positional accuracy, and to provide a manufacturing method of a multilayer printed board using the wiring board. <P>SOLUTION: The conductive paste through hole is formed by providing a conductive layer 13 with circuit formation on an insulated substrate 12, laminating a removable film 14 on the conductive layer 13, making a through hole 15 on the removable film 14, the conductive layer 13, and the insulated substrate 12, then filling the through hole 15 with conductive paste 16, and removing the removable film 14. The wiring board 17 thus obtained can be used to manufacture a single-layer or multilayer printed board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
