METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE

摘要

A method for manufacturing a surface acoustic wave device includes a substrate thickness reduction step of reducing the thickness of a piezoelectric substrate by machining a principal surface of the piezoelectric substrate, and a bonding step of bonding a support substrate having a smaller coefficient of linear expansion than the piezoelectric substrate through a resin adhesive layer to the piezoelectric substrate the thickness of which is reduced.