COMPLIANT BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES

摘要

A compliant bonding structure is disposed between a semiconductor light emitting device and a mount (40). When the semiconductor light emitting device is attached to the mount, for example by providing pressure, heat, and/or ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps (32) that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer (46).