发明名称 |
PROCESS FOR FORMATION OF HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING |
摘要 |
<p>Disclosed is a simplified process for formation of a hierarchical microstructure having no heterogeneous interface using partial curing. To achieve the above, provided is a process for the formation of a hierarchical microstructure using partial curing which comprises the steps of: forming a first polymer pattern having a partial curing layer; and forming a second polymer pattern on the first polymer pattern using said partial curing layer. According to the present invention, the formation of a microstructure having various hierarchical structures can be simplified. Therefore, the productivity and economic efficiency of various processes which require the formation of a microstructure having various hierarchical structures can be enhanced. In addition, a new functional material can be developed, which has not only a super hydrophobic surface but also high adhesiveness even on rough surfaces.</p> |
申请公布号 |
WO2010123162(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
WO2009KR02052 |
申请日期 |
2009.04.20 |
申请人 |
SNU R&DB FOUNDATION;SUH, KAHP YANG;JEONG, HOON EUI;KAWK, NO KYUN |
发明人 |
SUH, KAHP YANG;JEONG, HOON EUI;KAWK, NO KYUN |
分类号 |
H01L21/027;B82B3/00 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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