发明名称 PROCESS FOR FORMATION OF HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING
摘要 <p>Disclosed is a simplified process for formation of a hierarchical microstructure having no heterogeneous interface using partial curing. To achieve the above, provided is a process for the formation of a hierarchical microstructure using partial curing which comprises the steps of: forming a first polymer pattern having a partial curing layer; and forming a second polymer pattern on the first polymer pattern using said partial curing layer. According to the present invention, the formation of a microstructure having various hierarchical structures can be simplified. Therefore, the productivity and economic efficiency of various processes which require the formation of a microstructure having various hierarchical structures can be enhanced. In addition, a new functional material can be developed, which has not only a super hydrophobic surface but also high adhesiveness even on rough surfaces.</p>
申请公布号 WO2010123162(A1) 申请公布日期 2010.10.28
申请号 WO2009KR02052 申请日期 2009.04.20
申请人 SNU R&DB FOUNDATION;SUH, KAHP YANG;JEONG, HOON EUI;KAWK, NO KYUN 发明人 SUH, KAHP YANG;JEONG, HOON EUI;KAWK, NO KYUN
分类号 H01L21/027;B82B3/00 主分类号 H01L21/027
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