| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin type semiconductor device for suppressing warpage of semiconductor chips, and also to provide a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device has: a wiring board 47, a chip laminate 46 comprising two or more semiconductor chips 41-45 laminated on one surface 47a of the wiring board 47; a first sealing body 26 formed to cover side faces 41c-45c of the semiconductor chips 41-45; a second sealing body 29 formed to cover the first sealing body 26; and an external terminal 28 formed on the other surface 47b of the wiring board 47. In the semiconductor device, the chip laminate 46 has: a thin plate type semiconductor chip 39; and a thick plate type semiconductor chip 40 having a plate thickness thicker than that of the thin plate type semiconductor chip 39. A circuit formation surface 48a of the thick plate type semiconductor chip 40 is directed toward the thin plate type semiconductor chip 39. <P>COPYRIGHT: (C)2011,JPO&INPIT |
