发明名称 POLYETHYLENE-BASED RESIN COMPOSITION FOR NON-CROSSLINKED FOAMING, AND FOAMING MOLDED ARTICLE CONTAINING THIS COMPOSITION, AND MOLDED PRODUCT FOR AGGREGATE PACKAGING OF ELECTRONIC PART
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a foaming molded article including a polyethylene based resin composition for non-crosslinked foaming having such sufficient foaming states that the closed cell ratio is high and the uniformness of a cell and the appearance of a surface are sufficient, and excellent in flexibility, a mechanical characteristic, heat-resistance stability and secondary processability, in more detail, a gathering packaging molded product of an electronic part. <P>SOLUTION: The polyethylene based resin composition for non-crosslinked foaming is an ethylene single polymer or a copolymer of ethylene and a specificα-olefin, and is characterized in that it includes 90-40 mass% of a linear polyethylene (α) in which the density, melt flow rate, Mw/Mn, the number of melting point peaks of the endotherm curve and the crystallization temperature satisfy specific requirements, and 10-60 mass% of a branched low density polyethylene (β) by a high pressure method in which the density and melt flow rate satisfy specific requirements, and the melt tension at 190°C is 10-40 mN. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010242080(A) 申请公布日期 2010.10.28
申请号 JP20100062858 申请日期 2010.03.18
申请人 ASAHI KASEI CHEMICALS CORP 发明人 YAMAMOTO MINORU
分类号 C08J9/04;B65D1/00;B65D65/02;C08F4/6592;C08F10/02 主分类号 C08J9/04
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