发明名称 LASER MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining method having excellent machining quality and machining efficiency. <P>SOLUTION: When a hole is machined by laser beam having the diameter smaller than the diameter of the hole to be machined, for example, when laser beam is applied to the same part three times in order to obtain the depth of the hole, the laser beam is applied three times along the concentric tracks L1, L2, L3 around the center O of the hole to machine the hole of the desired depth. The outwardly moving directions of the tracks L1, L2, L3 from the inner track are deviated from each other by 120°around the center O of the hole, and any damage of a hole bottom at the starting point can be reduced compared to a case in which the laser beam is moved along the track L1 three times. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010240743(A) 申请公布日期 2010.10.28
申请号 JP20100163946 申请日期 2010.07.21
申请人 HITACHI VIA MECHANICS LTD 发明人 KITAMURA DAISUKE;TOYAMA SOICHI;OKUBO YAICHI;SUGAWARA HIROYUKI;OTSUKI HARUAKI
分类号 B23K26/38;B23K26/04;H05K3/00 主分类号 B23K26/38
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