| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has efficiency excellent in heat dissipation from a semiconductor element to cooling liquid and also has small restriction on selection of cooling liquid, to provide a method of manufacturing the same, and to provide equipment using the same. <P>SOLUTION: In the semiconductor device 1 having the semiconductor element 4 generating heat during its use and a cooler 2 containing the cooling liquid for heat dissipation of the semiconductor element 4, the semiconductor element 4 is fitted to the inner surface side of a lid member 23 of the cooler 2, and a waterproof coating layer 43 which prevents the semiconductor element 4 and cooling liquid 20 from coming into contact with each other is provided in the cooler 2. Consequently, only the waterproof coating layer 43 is present between the semiconductor element 4 and cooling water 20, and the heat dissipation of the semiconductor element 4 is extremely good. Further, the semiconductor element 4 and cooling water 20 do not come into direct contact with each other. Furthermore, a circuit board 3 is pasted on the outer surface of the lid member 23 to improve heat dissipation of the circuit board 3 as well. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
