发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module for suppressing deformation owing to the warpage of a connecting electrode having an insulating layer and having improved durability to repeated stress by heating and cooling and improved thermal efficiency. SOLUTION: A thermoelectric element module comprises a high-temperature side heat exchanger 22, a low-temperature side heat exchanger 21, and a plurality of thermoelectric elements 30 which are sandwiched between the high-temperature side heat exchanger and the low-temperature side heat exchanger to perform power generation by a difference in temperature. The thermoelectric element is bonded to a laminated electrode 32 through a brazing material. The laminated electrode is bonded to substrates 40 and 41 through the brazing material. The substrates are integrated or connected with the heat exchangers. In the laminated electrode, a conductive element bonding electrode 32a, an insulating member 32b, and a conductive substrate bonding member 32c are bonded through the brazing material in the order from the thermoelectric element side to the substrate side. The bending stresses to the insulating member due to a difference in linear expansion of the element bonding electrode and the substrate bonding member are equal. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010245265(A) 申请公布日期 2010.10.28
申请号 JP20090092064 申请日期 2009.04.06
申请人 HONDA MOTOR CO LTD 发明人 MORI MASAYOSHI;YAMAGAMI TAKESHI;KARASAWA MITSUMASA;HARAGUCHI TOMOHIDE;MATSUDA HIROSHI;OZAWA TETSUYA
分类号 H01L35/32;H01L35/30;H02N11/00 主分类号 H01L35/32
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