发明名称 HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS
摘要 A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.
申请公布号 US2010271149(A1) 申请公布日期 2010.10.28
申请号 US20090471339 申请日期 2009.05.22
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HSIEH PO-CHUAN;HSU SHOU-KUO;PAI YU-CHANG;LIU CHIEN-HUNG
分类号 H03H7/38 主分类号 H03H7/38
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