| 摘要 |
A semiconductor assembly comprises a plurality of semiconductor dies that are stacked one on top of the other and bonded to each other using a two-part adhesive system, in which one part of the adhesive system is applied to the top side of one die and the second part of the adhesive system is applied to the back side of another die, in which the two parts of the adhesive system are reactive with each other, and in which the two parts of the adhesive system when contacted together initiate a reaction and partial curing between the two parts of the adhesive system. |
