Embodiments described herein generally relate to an apparatus and method for uniform sputter depositing of materials into the bottom and sidewalls of high aspect ratio features on a substrate. In one embodiment, a collimator for mechanical and electrical coupling with a shield member positioned between a sputtering target and a substrate support pedestal is provided. The collimator comprises a central region and a peripheral region, wherein the collimator has a plurality of apertures extending therethrough and where the apertures located in the central region have a higher aspect ratio than the apertures located in the peripheral region.
申请公布号
WO2010123680(A2)
申请公布日期
2010.10.28
申请号
WO2010US30116
申请日期
2010.04.06
申请人
APPLIED MATERIALS, INC.;RIKER, MARTIN, L.;EWERT, MAURICE, E.;SUBRAMANI, ANANTHA, K.
发明人
RIKER, MARTIN, L.;EWERT, MAURICE, E.;SUBRAMANI, ANANTHA, K.