| 摘要 |
PROBLEM TO BE SOLVED: To stably connect a semiconductor element to a circuit board. SOLUTION: The semiconductor device includes: first conductor pads 4 provided on a top surface of a circuit board 5 of organic material; projection bums 2 provided on a first semiconductor element 1 and electrically connected to the first conductor pads; a second semiconductor element 10 mounted on a lower surface side of the circuit board; solder bumps 9 provided on a circuit board surface side of the second semiconductor element; and semiconductor pads 6 provided on the lower surface of the circuit board at positions corresponding to the solder bumps. The semiconductor element 10 has a plurality of bump arrays where the plurality of solder bumps 9 are arrayed, intervals between those solder bumps are larger than intervals of the projection bumps 2, and the first conductor pads 4 are arranged in a region corresponding to the region where the second conductor pads 6 are formed. Consequently, deformation of the circuit board is suppressed and the projection bumps 2 are uniform in height, thereby making bumps connections maintaining superior connection reliability. COPYRIGHT: (C)2011,JPO&INPIT
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