发明名称 SUBSTRATE INSPECTION METHOD AND SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection device and a substrate inspection method capable of precisely inspecting wiring even when there is variation in width, thickness, or electric resistivity of the wiring due to the history of production processes. SOLUTION: The substrate inspection method for determining the quality of the wiring formed on a substrate to be inspected includes: supplying a current to two reference wirings having different widths preset in the substrate to measure respective voltages; calculating thickness information and/or electric resistivity information on the two reference wirings, respectively, on the basis of the current value and the voltage value; and determining the quality of the wiring to be inspected on the basis of the thickness information or the electric resistivity information. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010243256(A) 申请公布日期 2010.10.28
申请号 JP20090090323 申请日期 2009.04.02
申请人 NIDEC-READ CORP 发明人 YAMASHITA MUNEHIRO;YANO AKIHIRO;TAKAHASHI TADASHI
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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