| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation device for cooling electronic components, and to provide fasteners thereof. SOLUTION: Each of the fasteners 60 includes a connecting portion 62, and a first operating portion 64 extending from the connecting portion and configured to be operated by a first tool. A second operating portion 642 is formed at an end face of the first operating portion and configured to be operated by a second tool. Further, the heat dissipation device includes a heat sink 20, a heat pipe 30, a heat absorbing plate 40, a fixing sheet 50, and the plurality of fasteners. The heat pipe has both ends connected to the absorbing plate and heat sink separately, and the fasteners penetrate the fixing sheet to press an end of the heat pipe against the heat absorbing plate. COPYRIGHT: (C)2011,JPO&INPIT |
