| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce thermal expansion in a surface direction while securing high thermal conductivity in a thickness direction of a board. <P>SOLUTION: A heat conduction composite material includes: a core material 11 formed by a material with a comparatively small coefficient of thermal expansion and having a plurality of through holes 11a penetrating along a thickness direction of a board; a pair of surface layer materials 13, 14 formed by a material with a larger thermal conductivity as compared with the core material 11 and laminated on the two surfaces of the core material 11; and heat transfer materials 12 formed by a material with a larger thermal conductivity as compared with the core material 11 and arranged in each of the plurality of through holes 11a in contact with the pair of surface layer materials 13, 14, while securing a gap in at least a portion between an inner wall surface of each of the through holes 11a and each of the heat transfer materials. Between the core material 11 and the pair of surface layer materials 13, 14 and between the heat transfer materials 12 and the pair of surface layer materials 13, 14 are unified by diffusion joining. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
