| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents a pair of electromagnetically coupled inductors from leaching each other by at least the thickness of a substrate. <P>SOLUTION: The semiconductor device 1 includes a pair of electromagnetically coupled inductors 5 and 6. The inductors 5 and 6 each includes a plurality of through electrodes penetrating a semiconductor device substrate 3a and interconnects connecting the plurality of through electrodes in series. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2010245371(A) |
申请公布日期 |
2010.10.28 |
| 申请号 |
JP20090093791 |
申请日期 |
2009.04.08 |
| 申请人 |
ELPIDA MEMORY INC;HIROSHIMA UNIV |
发明人 |
IKEDA HIROAKI;SHIOSAKI MITSURU;IWATA ATSUSHI |
| 分类号 |
H01L21/822;H01L21/3205;H01L23/52;H01L27/04 |
主分类号 |
H01L21/822 |
| 代理机构 |
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