| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of easily and excellently sealing an electronic element, and to provide a manufacturing method thereof. SOLUTION: An electronic device includes: a substrate 2; an element 3 formed on the substrate 2; an inner sealing member 5 provided on the substrate 2, surrounding a space 4 including the element 3, and including a through-hole 5a; and an outer sealing member 6 provided outside the inner sealing member 5, surrounding a space including the inner sealing member 5, and including a through-hole 6a. The through-hole 6a of the outer sealing member 6 is closed from the inside with the inner sealing member 5. COPYRIGHT: (C)2011,JPO&INPIT
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