| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device for accurately controlling the pressure in a reaction furnace. SOLUTION: A vacuum evacuation device 94 such as a vacuum pump is connected to a downstream side of an exhaust pipe 86 opposite to a connection side for a manifold through a gas cooling body 90 which cools gas exhausted from a processing chamber and a pressure control unit 92. Further, a pressure sensor 96 is provided upstream from the gas cooling body 90. Thus, vacuum evacuation is carried out so that the pressure in the processing chamber reaches predetermined pressure (vacuum). COPYRIGHT: (C)2011,JPO&INPIT
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