| 发明名称 |
Dual Interconnection in Stacked Memory and Controller Module |
| 摘要 |
A chip package transmitting slow speed signals via edge connectors and high speed signals by means of through-silicon-vias. The edge connectors are formed in recesses formed in the sidewalls of the package. |
| 申请公布号 |
US2010270668(A1) |
申请公布日期 |
2010.10.28 |
| 申请号 |
US20090431569 |
申请日期 |
2009.04.28 |
| 申请人 |
WAFER-LEVEL PACKAGING PORTFOLIO LLC |
发明人 |
MARCOUX PHIL P. |
| 分类号 |
H01L23/48;H01L21/50;H01L21/762;H01L21/768;H01L23/52 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 地址 |
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