| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component which can control the connection failures of a substrate electrode 11 of a wiring substrate 10 with an electrode pad 51 of an electronic component 50 better than conventionally. SOLUTION: One mask which is made of an insulating material and in which the diameter of a through-hole 2 on a cream solder imprinting surface side at least is made larger than the diameter of a substrate electrode 11 of a wiring substrate 10 is used as a printing mask 1. In a step of forming a solder layer, cream solder is imprinted in the through-hole 2 of the printing mask 1; then a step of forming the solder layer is ended, without peeling the printing mask 1 off of the wiring substrate 10; in a placing step, an electronic component 50 is placed on the printing mask 1 adhered to the wiring substrate 10 and an electrode pad 51 of the electronic component 50 and a cream solder layer in the through-hole 2 are adhered to each other; and in a jointing step, the cream solder layer in the through-hole 2 is heated. COPYRIGHT: (C)2011,JPO&INPIT |
