| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure which achieves highly reliable bonding of a metal member and a ceramic member and in which cracks do not occur in the ceramic member and to provide a highly reliable semiconductor element storing package having the bonding structure. SOLUTION: The bonding structure is provided with: a first member 11 formed of a metal; a second member 12 which is made of ceramics and bonded to the first member 11 and has a metal layer 12a on a surface; a third member 13 formed of a metal arranged over the metal layer 12a of the second member 12 from the first member 11; a brazing material 14 disposed between the first member 11 and the metal layer 12a of the second member 12, and the third member 13; and fillets 15 and 16 formed of the brazing material 14 at a periphery of the third member 13. The third member 13 is provided with a chamfering part 17 serving as an accumulation part of the brazing material 14 only in a part confronting the second member 12 in the bonding structure. The semiconductor element storing package is provided with such a bonded structure. COPYRIGHT: (C)2011,JPO&INPIT |
