发明名称 ORGANIC EL DEVICE, MANUFACTURING METHOD OF ORGANIC EL DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide an organic EL device with high mechanical strength and excellent sealing properties. SOLUTION: In the organic EL device 1, an organic EL panel 2 and a wiring board 3A are pinched by a pair of film sheets 41A, 41B, which 41A, 41B are bonded together at a peripheral edge part of the organic EL panel 2, whereby, the organic EL panel 2 is sealed inside the film sheets 41A, 41B. First sealing resin layers 43 are formed, respectively, at a gap 4H between the film sheets 41A, 41B and the organic EL panel 2 and at a gap 4H between the film sheets 41A, 41B formed at an end face of the wiring board 3A and the wiring board 3A, and the gaps 4H are sealed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010244698(A) 申请公布日期 2010.10.28
申请号 JP20090088721 申请日期 2009.04.01
申请人 SEIKO EPSON CORP 发明人 GYODA KOZO;YAMADA TADASHI
分类号 H05B33/04;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H05B33/02;H05B33/10 主分类号 H05B33/04
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