| 摘要 |
PROBLEM TO BE SOLVED: To efficiently fix a shield cover to a board and also reliably fix the shield cover even against warpage of the board in reflow, in a method of manufacturing an electronic component constituted such that a flip chip or a surface mounting component is mounted on the board and covered with the shield cover. SOLUTION: Each part of all of four peripheral end sides, in which a plurality of recessed parts of a shield cover are formed, is fixed by solder to each side of a shield pad of a sheet board together with the plurality of recessed parts. COPYRIGHT: (C)2011,JPO&INPIT
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