发明名称 LASER PROCESSING DEVICE AND METHOD OF LASER PROCESSING
摘要 <p>In order to ensure the quality of an object to be processed after processing, a laser processing device (10) is equipped with: a laser oscillator (18) that oscillates a laser beam (L); a beam splitter (20) that splits the laser beam (L) into a first laser beam (L1) and a second laser beam (L2); a first lens (22) through which the first laser beam (L1) is radiated towards a section of an object to be processed (30) in order to slice the object to be processed (30); and a total reflecting mirror (24), a second lens (26), and a galvano mirror (28) by which the second laser beam (L2) is radiated towards burrs (32, 34) that formed on the object to be processed (30) as the object to be processed (30) was sliced, in order to make the burrs (32, 34) smooth. Even if burrs (32, 34) have formed on the object to be processed (30) as the object to be processed (30) is being sliced, the burrs (32, 34) can be made smooth by the second laser beam (L2), thereby ensuring the quality of the object to be processed (30) after processing.</p>
申请公布号 WO2010123068(A1) 申请公布日期 2010.10.28
申请号 WO2010JP57155 申请日期 2010.04.22
申请人 FURUKAWA ELECTRIC CO., LTD.;ARAI, TAKEJI;KAYAHARA, TAKASHI 发明人 ARAI, TAKEJI;KAYAHARA, TAKASHI
分类号 B23K26/067;B23K26/00;B23K26/36;B23K26/38 主分类号 B23K26/067
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