| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of bonding an electronic component with a bump that secures excellent bonding strength by actualizing a uniform bonding state in the same bump. <P>SOLUTION: In an operation to bond the bump 30a of the electronic component 30 with the bump to an electrode 32b on a surface to be pressed against by pressing the bump 30a against the electrode 32b and applying ultrasonic vibrations, a bonding head is lowered to bring the bump 30a into contact with the electrode 32b, and further lowered until the bump 30a reaches a predetermined bump height (b), and while the gap between the electronic component 30 and the electrode 32b is held at the bump height (b) as a preset target value, the electronic component 30 is applied with ultrasonic vibrations for a predetermined time. Consequently, the time for which the ultraviolet vibrations are applied is made equal over the entire range of area A by which a reverse surface of the bump 30a comes into contact with the electrode 32b to obtain the uniform bonding state, thereby securing the excellent bonding strength. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
