| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection structure of a BGA package for a semiconductor device that comes into contact with solder balls at a low cost without using a dedicated IC socket. <P>SOLUTION: On a solder ball 2 formation surface side of a semiconductor device 1 where a plurality of solder balls 2 are formed, a printed wiring board 6 provided with a pad 5 where solder balls 2 are arranged at the same intervals is arranged oppositely, and a printed wiring board 2 and a conductive rubber 10 are sandwiched between the semiconductor device 1 and printed wiring board 6. On the top and reverse surfaces of the printed wiring board 9, pluralities of lands 7 and lands 8 are provided at intervals same as the solder balls 2 of the semiconductor device 1, and connected between the pluralities of the land 7 and the land 8 through through-holes. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
