| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an MEMS sensor especially capable of lowering the maximum peeling stress by dispersing peeling stress. SOLUTION: A recessed part 11 with bottom is formed on a front surface 10a side of a first silicon substrate 10, wherein a retreating region 14a, retreating from an opening side edge part 11a toward a bottom face 11b direction of the recessed part 11 in the direction of spreading a width dimension of the recessed part 11, is provided to a sidewall 14 of the recessed part 11. Continuously, an oxide insulating layer is formed on at least one of the surface of the first silicon substrate 10 and the surface of a second substrate. Continuously, the surface of the first silicon substrate 10 and the surface of the second silicon substrate are bonded together to make the recessed part 11 into a closed space, and in this state, heat treatment is performed. By providing the retreating region 14a on the bonding side of the sidewall 14 to the second silicon substrate, the peeling stress applied to the vicinity of the edge part of the recessed part 11 when the heat treatment is performed can be dispersed to lower the maximum peeling stress. COPYRIGHT: (C)2011,JPO&INPIT
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