| 摘要 |
The present invention provides a wafer cleaning machine, which includes a machine base, a rotating disk for bearing and driving a wafer, a first nozzle for spraying ion water to the surface of wafer, a brushing module, and a second nozzle. The rotating disk is connected with the machine base. The first nozzle is connected with the machine base and it is above the rotating disk. The brushing module is connected with the machine base and it is above the rotating disk. The second nozzle is connected with the machine base and it is above the rotating disk.
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