| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide alkali-free glass which satisfies various properties to be requested when used in a CSP (chip size package) or the like, has a thermal expansion coefficient consistent particularly with that of Si and excellent bubble quality even when As<SB>2</SB>O<SB>3</SB>or Sb<SB>2</SB>O<SB>3</SB>is not used therein, is low cost and can be formed into a thin sheet. <P>SOLUTION: The alkali-free glass contains, as a glass composition expressed in mass% in terms of oxides, 45-70% SiO<SB>2</SB>, 10-30% Al<SB>2</SB>O<SB>3</SB>, 11-20% B<SB>2</SB>O<SB>3</SB>and has <0.1% As<SB>2</SB>O<SB>3</SB>content, <0.1% Sb<SB>2</SB>O<SB>3</SB>content and <0.1% alkali metal oxide content and 30-35×10<SP>-7</SP>/°C thermal expansion coefficient at 30-380°C. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
