| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To integrate additional processes as components, of vertical wiring for forming a structure of an electronic device package, and to produce very simply and inexpensively by using conventionally-used normal manufacturing technique using die pressing. <P>SOLUTION: The component for wiring is used by being incorporated in an electronic device package including a circuit element containing a semiconductor chip arranged on a substrate with a wiring layer formed on an upper surface. The component for wiring includes a post electrode formed by half-punching a metal plate having a thickness equal to a height of the post electrode, and a half-punch plate connected to the post electrode via a joint part. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
