发明名称 |
POLISHING APPARATUS |
摘要 |
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
|
申请公布号 |
US2010273405(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
US20090747225 |
申请日期 |
2009.02.09 |
申请人 |
FUKUSHIMA MAKOTO;TOGAWA TETSUJI;YASUDA HOZUMI;SAITO KOJI;NABEYA OSAMU;INOUE TOMOSHI |
发明人 |
FUKUSHIMA MAKOTO;TOGAWA TETSUJI;YASUDA HOZUMI;SAITO KOJI;NABEYA OSAMU;INOUE TOMOSHI |
分类号 |
B24B7/20;B24B37/30;B24B37/32;B24B55/02 |
主分类号 |
B24B7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|