发明名称 |
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME |
摘要 |
Disclosed is a substrate for a printed wiring board, which has no size limit since a vacuum facility is not required for the production of the same. The substrate for a printed wiring board does not use an organic adhesive and comprises a sufficiently thin conductive layer (copper foil layer). Also disclosed are a printed wiring board, a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. Specifically disclosed is a substrate (1) for a printed wiring board, which comprises an insulating base (11), a first conductive layer (12) that is arranged on the insulating base (11), and a second conductive layer (13) that is arranged on the first conductive layer (12). The first conductive layer (12) is configured as a coating layer of a conductive ink that contains metal particles, and the second conductive layer (13) is configured as a plating layer. |
申请公布号 |
WO2010122918(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
WO2010JP56556 |
申请日期 |
2010.04.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;OKA, YOSHIO;KASUGA, TAKASHI;OKADA, ISSEI;MIKAGE, KATSUNARI;UENISHI, NAOTA;OKUDA, YASUHIRO |
发明人 |
OKA, YOSHIO;KASUGA, TAKASHI;OKADA, ISSEI;MIKAGE, KATSUNARI;UENISHI, NAOTA;OKUDA, YASUHIRO |
分类号 |
H05K1/09;B32B15/04;H05K3/24;H05K3/38 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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