发明名称 |
CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION, CONDUCTIVE POLYAMIDE RESIN COMPOSITIONS, AND CONDUCTIVE POLYAMIDE FILM |
摘要 |
<p>(1) A conductive polyamide resin composition which comprises a polyamide resin comprising a polyamide having a structure corresponding to a polycondensation product obtained by polycondensation in which a diamine comprising pentamethylenediamine and a dicarboxylic acid are used as monomer ingredients (hereinafter referred to as "polyamide 5X") and a conductivity-imparting agent, wherein the conductive polyamide resin composition has an ash content within a specific range and a film formed from the conductive polyamide resin composition has a volume resistivity within a specific range; (2) a conductive thermoplastic resin composition which comprises a thermoplastic resin (a) selected from polyamide resins 5X, a thermoplastic resin (b) having a solubility parameter different from that of the thermoplastic resin (a), and a conductivity-imparting agent; and (3) a conductive polyamide resin composition which comprises the polyamide 5X and a modified elastomer in specific amounts.</p> |
申请公布号 |
WO2010122886(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
WO2010JP55976 |
申请日期 |
2010.03.31 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION;HITOMI TATSUYA;NAKATA MICHIO;YAMAMOTO MASANORI;KUSANO KAZUNAO;TSUNODA MORIO;WATANABE KEN |
发明人 |
HITOMI TATSUYA;NAKATA MICHIO;YAMAMOTO MASANORI;KUSANO KAZUNAO;TSUNODA MORIO;WATANABE KEN |
分类号 |
C08L77/06;C08K3/04 |
主分类号 |
C08L77/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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