发明名称 |
Array-Substrat mit Kupferleitern und Herstellungsverfahren dafür |
摘要 |
An array substrate includes a switching element (155), a signal transmission line (131), passivation layer (116) and a pixel electrode (112). The switching element is disposed on an insulating substrate (120). The signal transmission line is connected to the switching element and includes a barrier layer (131a), a conductive line (131b), and a copper nitride layer (131c). The barrier layer is disposed on the insulating substrate. The conductive line is disposed on the barrier layer and includes copper or copper alloy. The copper nitride layer covers the conductive line. The passivation layer covers the switching element and the signal transmission line and has a contact hole (151) through which a drain electrode (119) of the switching element is partially exposed. The pixel electrode (112) is disposed on the insulating substrate, and is connected to the drain electrode (119) of the switching element (155) through the contact hole (151). |
申请公布号 |
DE602007009162(D1) |
申请公布日期 |
2010.10.28 |
申请号 |
DE20076009162T |
申请日期 |
2007.07.19 |
申请人 |
SAMSUNG ELECTRONICS CO. LTD. |
发明人 |
LEE, JE-HUN;KIM, DO-HYUN;LEE, EUN-GUK;JEONG, CHANG-OH |
分类号 |
G02F1/1362;G09F9/30;H01L21/28;H01L21/318;H01L21/3205;H01L21/336;H01L21/768;H01L23/532;H01L29/417;H01L29/423;H01L29/49;H01L29/786 |
主分类号 |
G02F1/1362 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|