| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate flexure and cracks of a semiconductor substrate on a semiconductor device having a photodetector (light receiving part) and control the flexure of the photodetector (light receiving part), thus improving the yield and imaging property. <P>SOLUTION: The semiconductor device 1 is constructed by preparing a semiconductor substrate 2 having mutually facing first and second surfaces, a light receiving part 3 prepared on the semiconductor substrate's first surface, and a translucent protection member 4 arranged so as to cover and get close to the first surface of the semiconductor substrate, wherein for translucent protection member is formed with two or more recesses facing the light receiving part. <P>COPYRIGHT: (C)2011,JPO&INPIT |
