| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device, reducing a thickness of a gold (Au) plated film without lowering any bonding property of a flying lead, and also without causing any inconveniences such as dissolving of a conductor pattern surface, a deterioration of a workability and increase of a working cost, and also to provide a method of manufacturing the tape carrier. <P>SOLUTION: The tape carrier for the semiconductor device is provided with a conductor pattern 2 containing a flying lead section 3 formed by carrying out a pattern processing of a copper (Cu) foil. The tape carrier is also equipped with plated laminate films 7 formed by laminating a nickel (Ni) plated film 4, a palladium (Pd) plated film 5, and a gold (Au) plated film 6 in this order, on a surface of the conductor pattern 2 including a surface of at least the flying lead section 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
