发明名称 COVER MODULE OF ELECTRONIC DEVICE, AND METHOD OF CONTROLLING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an economically useful cover module. <P>SOLUTION: The cover module is attached to an electronic device and is suitable for the protection of a connector of the electronic device. The cover module includes a body, a flip cover, and a flexible connecting element. The body has an opening exposing the connector. A sidewall of the opening has a first fixing structure. The flip cover is in the opening, and a sidewall of the flip cover has a second fixing structure locked with the first fixing structure. The flexible connecting element is connected between the body and the flip cover. When a force is applied to the flip cover, the flexible connecting element is deformed, the flip cover moves with the deformation of the flexible connecting element, and the locking between the first and the second fixing structures is released to cause the flip cover swinging open away from the body with a part of the flexible connecting element as an axis. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010244510(A) 申请公布日期 2010.10.28
申请号 JP20090218873 申请日期 2009.09.24
申请人 COMPAL ELECTRONICS INC 发明人 CHANG CHIN-HSIEN
分类号 G06F1/16;H05K5/03 主分类号 G06F1/16
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