| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces wiring delay and achieves high reliability and high quality, while maintaining a high degree of integration. SOLUTION: Two or more layers of semiconductor devices (layer constituting parts) in which a plurality of semiconductor chips are arranged in a horizontal direction are laminated. The semiconductor chips at least immediately between upper and lower layers are arranged so that the horizontal positions of them are different from each other. The wiring for connecting the semiconductor chips between the layers or the wiring in the semiconductor chip in the same layer passes through a chip connecting element 2 for electrically connecting a through electrode 1 which penetrates the semiconductor chip with the semiconductor chip in the different layer from the through electrode 1. COPYRIGHT: (C)2011,JPO&INPIT
|
