| 发明名称 |
RINSE FORMULATION FOR USE IN THE MANUFACTURE OF AN INTEGRATED CIRCUIT |
| 摘要 |
The present invention relates to a solution for treating a surface of a substrate for use in a semiconductor device. More particularly, the present invention relates to a liquid rinse formulation for use in semiconductor processing, wherein the liquid formulation contains: i. a surface passivation agent; and ii. an oxygen scavenger, wherein the pH of the rinse formulation is 8.0 or greater.
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| 申请公布号 |
US2010273330(A1) |
申请公布日期 |
2010.10.28 |
| 申请号 |
US20090377810 |
申请日期 |
2009.02.17 |
| 申请人 |
CITIBANK N.A. AS COLLATERAL AGENT |
发明人 |
FARKAS JANOS;CALVO-MUNEZ MARIA-LUISA;MONNOYER PHILIPPE;PETITDIDIER SEBASTIEN |
| 分类号 |
H01L21/302;C11D7/32;H01L21/461 |
主分类号 |
H01L21/302 |
| 代理机构 |
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