发明名称 COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>Two layers of protection films (8, 9) are formed such that a sheet resistance at a part directly below the protection film (8) is higher than that at a part directly below the protection film (9). The protection films (8, 9) are formed of, for instance, a SiN film, as insulating films. The protection film (8) is formed with a hydrogen concentration higher than that of, for instance, the protection film (9) so that the refractive index of the protection film (8) is higher than that of the protection film (9). The protection film (8) is formed to cover a gate electrode (7) and extend to the vicinity of the gate electrode (7) on an electron supplying layer (3). The protection film (9) is formed over the entire surface to cover the protection film (8). Thus, a highly reliable compound semiconductor device wherein a gate leak is remarkably reduced with the relatively simple configuration and high voltage operation, high withstand voltage and high output are achieved is provided.</p>
申请公布号 WO2010122628(A1) 申请公布日期 2010.10.28
申请号 WO2009JP57854 申请日期 2009.04.20
申请人 FUJITSU LIMITED;KANAMURA, MASAHITO;MAKIYAMA, KOZO 发明人 KANAMURA, MASAHITO;MAKIYAMA, KOZO
分类号 H01L21/338;H01L21/318;H01L29/778;H01L29/812 主分类号 H01L21/338
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