Sensor arrangement, has adhesive layer partially embedded into mold housing, where adhesive layer below contact section is thinner than adhesive layer below sensitive section at region of recess in support surface

摘要

The arrangement (1) has a sensor element (10) e.g. microelectromechanical system element, comprising a contact section (12), which is partially embedded into a mold housing (30) i.e. open cavity full mold housing. The housing comprises an access opening (31) for a sensitive section (11) of the element. An adhesive connection between the element and a support surface is extended over the contact section and by the sensitive section. An adhesive layer (40) below the contact section is thinner than an adhesive layer below the sensitive section at a region of a recess (21) in the support surface.