| 摘要 |
PROBLEM TO BE SOLVED: To provide a holder for semiconductor wafer, capable of suppressing the contamination of a semiconductor wafer accompanying the fouling of a contact holding layer, and to provide a method of detaching a semiconductor wafer. SOLUTION: The holder for semiconductor wafer has a support substrate 1 and the contact holding layer 10, which comes into detachable contact with a surface of the support substrate 1 to hold the semiconductor wafer W and which has flexibility, and serves for a solder reflow device in such a state that the semiconductor wafer W is held, wherein the support substrate 1 and contact holding layer 10 are formed in the same shape and size as the semiconductor wafer W, and heat resistance properties are respectively given to the support substrate 1 and contact holding layer 10. Also, a plurality of guide grooves 2 are formed in the surface-diameter direction of the support substrate 1, and by making a separation liquid 3 go into a plurality of guide grooves 2, the contact holding layer 10 is separated from the surface of the support substrate 1. A new contact holding layer 10 is used each time a new semiconductor wafer W is processed, thereby, the previous fouling of a contact holding layer 10 never moves to the new semiconductor wafer W. COPYRIGHT: (C)2011,JPO&INPIT |
