发明名称 SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor device which allows a wiring pattern to be easily changed without changing design and production process of the wiring pattern inside a sensor, depending on a function and arrangement of a connection terminal provided on an outer circuit and a method of manufacturing the same. <P>SOLUTION: In one embodiment of this prevention, the sensor device includes a plurality of sensor elements formed in an element forming region of a substrate, a plurality of connection pads formed on the substrate other than an element arranging region, a plurality of first wiring formed on the substrate and electrically connected with the plurality of sensor elements, a plurality of second wiring formed on the substrate and electrically connected with the plurality of connection pads, a plurality of third wiring formed on a layer different from a layer where the plurality of first wiring and the plurality of second wiring formed so as to intersect with the plurality of first wiring and the plurality of second wiring, and an insulation layer formed between the plurality of first wiring, the plurality of second wiring and the plurality of third wiring and having through-holes formed at positions where the plurality of first wiring, the plurality of second wiring and the plurality of third wiring intersect. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010245353(A) 申请公布日期 2010.10.28
申请号 JP20090093398 申请日期 2009.04.07
申请人 DAINIPPON PRINTING CO LTD 发明人 AIDA KAZUHIKO;HASHIMOTO KATSUMI
分类号 H01L29/84;G01P15/08;G01P15/12 主分类号 H01L29/84
代理机构 代理人
主权项
地址