| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal efficiency for obtaining desired temperature, to prevent cooling capability from decreasing when a substrate is cooled, and further to mount a plurality of semiconductor elements on one substrate. SOLUTION: The apparatus for manufacturing a semiconductor device that mounts semiconductor elements 1 on a wiring board 2 includes a stage 4 for supporting the wiring board 2, and a heating unit 15 for heating from the side of the semiconductor elements 1, and the stage 4 has a first flow passage 7 for sucking and fixing the wiring board 2, and a second flow passage 9 which is independent of the first flow passage 7 and in contact with a region of the wiring board 2 where the semiconductor elements 1 are mounted to thermally insulate the stage 4 and to cool the wiring board 2. COPYRIGHT: (C)2011,JPO&INPIT
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