发明名称 |
APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS |
摘要 |
An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.
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申请公布号 |
US2010270364(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
US20100833191 |
申请日期 |
2010.07.09 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;IIDA KIYOAKI |
分类号 |
B23K1/20 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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