发明名称 |
System and Method for Repairing Hermetic Solder Seals in RF Electronic Assemblies |
摘要 |
The system contains a laser beam source and a work piece having a soldered joint. A work piece holder holds the work piece at an angle relative to the laser beam source. A crack is formed in a soldered joint of the work piece. The laser beam source is positioned approximately centered on the crack. At least one temperature sensitive electronic element is contained within the work piece.
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申请公布号 |
US2010270276(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
US20090429450 |
申请日期 |
2009.04.24 |
申请人 |
COOKSON DOUGLAS E;KERVIN JONATHAN D |
发明人 |
COOKSON DOUGLAS E.;KERVIN JONATHAN D. |
分类号 |
B23K1/005;B23K31/02 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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