发明名称 System and Method for Repairing Hermetic Solder Seals in RF Electronic Assemblies
摘要 The system contains a laser beam source and a work piece having a soldered joint. A work piece holder holds the work piece at an angle relative to the laser beam source. A crack is formed in a soldered joint of the work piece. The laser beam source is positioned approximately centered on the crack. At least one temperature sensitive electronic element is contained within the work piece.
申请公布号 US2010270276(A1) 申请公布日期 2010.10.28
申请号 US20090429450 申请日期 2009.04.24
申请人 COOKSON DOUGLAS E;KERVIN JONATHAN D 发明人 COOKSON DOUGLAS E.;KERVIN JONATHAN D.
分类号 B23K1/005;B23K31/02 主分类号 B23K1/005
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