发明名称 PACKAGE DESIGNS FOR FULLY FUNCTIONAL AND PARTIALLY FUNCTIONAL CHIPS
摘要 A method including obtaining an operational status of a first processor core, where the first processor core is associated with a plurality of processor cores located on a chip; configuring a first IO block of a package design based on the operational status of the first processor core, where the package design is based on a fully functional chip; and configuring a stackup of the package design after configuring the first IO block for use with the chip.
申请公布号 US2010275171(A1) 申请公布日期 2010.10.28
申请号 US20100832777 申请日期 2010.07.08
申请人 ORACLE AMERICA, INC. 发明人 PANNALA SREEMALA
分类号 G06F17/50 主分类号 G06F17/50
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