发明名称 |
Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference |
摘要 |
A semiconductor device has an IPD structure formed over a substrate. First and second electrical devices are mounted to a first surface of the IPD structure. An encapsulant is deposited over the first and second electrical devices and IPD structure. A shielding layer is formed over the encapsulant and electrically connected to a conductive channel in the IPD structure. The conductive channel is connected to ground potential to isolate the first and second electrical devices from external interference. A recess can be formed in the encapsulant material between the first and second electrical devices. The shielding layer extends into the recess. An interconnect structure is formed on a second surface of the IPD structure. The interconnect structure is electrically connected to the first and second electrical devices and IPD structure. A shielding cage can be formed over the first electrical device prior to depositing encapsulant. |
申请公布号 |
US2010270661(A1) |
申请公布日期 |
2010.10.28 |
申请号 |
US20100830390 |
申请日期 |
2010.07.05 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A.;DO BYUNG TAI;LIN YAOJIAN;HUANG RUI |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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