Multilayer printed wiring board with solder resist composition,申请号EP20080022342-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Multilayer printed wiring board with solder resist composition
摘要
申请公布号	EP2053909(B1)	申请公布日期	2010.10.27
申请号	EP20080022342	申请日期	2000.07.28
申请人	IBIDEN CO., LTD.	发明人	ZHONG, HUI;SHIMADA, KENICHI;TOYODA, YUKIHIKO;ASAI, MOTOO;WANG, DONGDONG;SEKINE, KOJI;ONO, YOSHITAKA
分类号	H05K3/28;H05K3/46	主分类号	H05K3/28
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Methods for joint optimization of link equalization

Pre-equalization enhancement for telecommunication networks

Through-silicon vias with metal system fill

Safety net for a light bulb changer

Memory cells with read access schemes

Apparatuses and methods for reducing cycle times in successive memory accesses

Semiconductor memory apparatus

Banking system controlled responsive to data bearing records

Local search of network content

Adaptation of web-based text ads to mobile devices

Searching images and identifying images with similar facial features

Systems, methods and devices for providing visual privacy to messages

Systems and methods for predictive responses to internet object queries

System and method for conducting searches and displaying search results

Data growth balancing

Local emulation of distributed key-value data store

Thermally tuneable optical modulator adapted for differential signaling

Shooting headwear

Shooting bow with pulleys

Molded plastic stormwater chamber having a hinged top joint